Opportunity
faculty
FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Award Info:
In FY24, CHIPS R&D anticipates making available approximately $300,000,000 for funding of multiple awards in amounts up to approximately $100,000,000 over up to 5 years per award, not including voluntary co-investment, though additional funding may be provided to applicants who address more than one technical area.
Description:
This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.