FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates

Award Info:

In FY24, CHIPS R&D anticipates making available approximately $300,000,000 for funding of multiple awards in amounts up to approximately $100,000,000 over up to 5 years per award, not including voluntary co-investment, though additional funding may be provided to applicants who address more than one technical area.


This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.